France – Machines et appareils microélectroniques – Achat d’un équipement de scellements de substrats (Bondeur)
AI summary
This tender concerns the acquisition, delivery, installation and commissioning of a substrate sealing equipment (wire bonder) for microelectronics applications. The equipment must perform thermocompression or anodic bonding to join semiconductor substrates and components.
Equipment manufacturers or authorised resellers specialising in microelectronics assembly and bonding technology should apply.
Suppliers must be qualified equipment manufacturers or authorised distributors capable of delivering, installing and commissioning the substrate bonding system. Technical compliance with microelectronics standards and post-installation support are expected.
Frequently asked questions
What is this tender about?
This tender concerns the acquisition, delivery, installation and commissioning of a substrate sealing equipment (wire bonder) for microelectronics applications. The equipment must perform thermocompression or anodic bonding to join semiconductor substrates and components.
What are the requirements for suppliers?
Suppliers must be qualified equipment manufacturers or authorised distributors capable of delivering, installing and commissioning the substrate bonding system. Technical compliance with microelectronics standards and post-installation support are expected.
What type of company should bid?
Equipment manufacturers or authorised resellers specialising in microelectronics assembly and bonding technology should apply.
Who is the buyer?
The buyer is CNRS Délégation Régionale Hauts-de-France.
When does this tender close?
Submissions close on May 19, 2026.
What is the estimated value?
The estimated value is 520,000 EUR.
Acquisition, livraison, installation et mise en service d’un équipement de scellement de substrats (Bondeur) par thermocompression ou anodisation
Achat d’un équipement de scellements de substrats (Bondeur)
Acquisition, livraison, installation et mise en service d’un équipement de scellement de substrats (Bondeur) par thermocompression ou anodisation
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