France – Machines et appareils microélectroniques – Fourniture d'un équipement de recuit laser microseconde en 200 et 300mm

AI summary

This tender concerns the supply of a microsecond laser annealing equipment for 200mm and 300mm wafers. CEA-LETI seeks to acquire this tool to support research and development of FD-SOI technologies at 10nm and beyond, with in-situ thermal monitoring and automated wafer handling under controlled atmospheres.

#laser annealing#semiconductor equipment#microelectronics#fd-soi#grenoble#france
Fit for

Equipment manufacturers and system integrators specializing in semiconductor processing tools, particularly those with expertise in laser annealing systems and advanced microelectronics fabrication technology.

Key requirements

Suppliers must provide equipment capable of processing wafers under controlled atmospheres (nitrogen, argon, oxygen, hydrazine) with integrated in-situ thermal transition monitoring. Mandatory options include first-level maintenance training and second-year warranty; optional offerings include chiller and transformer supply.

Frequently asked questions

  • What is this tender about?

    This tender concerns the supply of a microsecond laser annealing equipment for 200mm and 300mm wafers. CEA-LETI seeks to acquire this tool to support research and development of FD-SOI technologies at 10nm and beyond, with in-situ thermal monitoring and automated wafer handling under controlled atmospheres.

  • What are the requirements for suppliers?

    Suppliers must provide equipment capable of processing wafers under controlled atmospheres (nitrogen, argon, oxygen, hydrazine) with integrated in-situ thermal transition monitoring. Mandatory options include first-level maintenance training and second-year warranty; optional offerings include chiller and transformer supply.

  • What type of company should bid?

    Equipment manufacturers and system integrators specializing in semiconductor processing tools, particularly those with expertise in laser annealing systems and advanced microelectronics fabrication technology.

  • Who is the buyer?

    The buyer is CEA Grenoble.

Pour ses activités de recherche axées sur le développement de technologies FD-SOI de 10 nm et au-delà, le CEA-LETI souhaite acquérir un nouvel outil de recuit laser microseconde afin de relever les défis technologiques à venir. L'équipement devra comporter un module de traitement avec surveillance in-situ des transitions thermiques, ainsi qu'une interface automatique pour wafers de 200 mm et 300 mm. Le recuit devra pouvoir se faire sous atmosphères contrôlées (azote, argon, oxygène, hydrazine). Le marché comporte : • Des options avec chiffrage obligatoire : o Option n°1 : La formation de maintenance premier niveau pour 3 personnes conformément à l’article 9 du cahier des charges o Option n°2 : Deuxième année de garantie pour l’Equipement • Des options avec chiffrage facultatif : o Option n°3 : Fourniture d’un chiller conformément à l’article 3.2.6 du cahier des charges o Option n°4 : Fourniture d’un transformateur électrique conformément à l’article 4.1.4 du cahier des charges o Option n°5 : La formation de maintenance avancée pour 2 personnes conformément à l’article 9 du cahier des charges

Buyer
CEA Grenoble
Buyer ID: 775 685 019 00298·M. Anguéran Thirion
17 rue des Martyrs, 38054, Grenoble
Body responsible for review procedures
Greffe Tribunal administratif de Grenoble
Buyer ID: 173800053
2 Place de Verdun Boîte Postale 1135, 38022, Grenoble Cedex
Other organization
Sumitomo Material Solution Europe SASU
Buyer ID: 802 526 574
145, rue des Caboeufs, 92230, GENNEVILLIERS
Other organization
Publications Office of the European Union
Buyer ID: PUBL
2417, Luxembourg

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