France – Fournitures électroniques, électromécaniques et électrotechniques – Équipement de 300 mm pour du dépôt métallique par de PVD

DeadlineMay 11, 2026 at 10:00 AMClosed 65 days ago

AI summary

This tender concerns the procurement of a 300 mm multi-chamber physical vapor deposition (PVD) equipment for metal deposition. The system must include at least five deposition chambers, a vacuum transfer platform, a dedicated oxidation chamber, a pre-cleaning chamber, and a degassing module, designed to support FD-SOI 10 nm and advanced semiconductor research at CEA-LETI.

#pvd equipment#semiconductor#300mm#metal deposition#france#cea grenoble#fdsoi
Fit for

Established manufacturers or integrators of semiconductor deposition equipment with proven experience in 300 mm PVD systems and multi-chamber configurations are sought. The supplier should demonstrate technical expertise in FD-SOI process technology and provide comprehensive support services.

Key requirements

Suppliers must provide a fully functional 300 mm PVD system capable of accommodating at least three FOUPs in the loading port. The equipment must meet detailed technical specifications outlined in the tender documentation, including vacuum integrity, chamber performance, and integration with existing research infrastructure.

Frequently asked questions

  • What is this tender about?

    This tender concerns the procurement of a 300 mm multi-chamber physical vapor deposition (PVD) equipment for metal deposition. The system must include at least five deposition chambers, a vacuum transfer platform, a dedicated oxidation chamber, a pre-cleaning chamber, and a degassing module, designed to support FD-SOI 10 nm and advanced semiconductor research at CEA-LETI.

  • What are the requirements for suppliers?

    Suppliers must provide a fully functional 300 mm PVD system capable of accommodating at least three FOUPs in the loading port. The equipment must meet detailed technical specifications outlined in the tender documentation, including vacuum integrity, chamber performance, and integration with existing research infrastructure.

  • What type of company should bid?

    Established manufacturers or integrators of semiconductor deposition equipment with proven experience in 300 mm PVD systems and multi-chamber configurations are sought. The supplier should demonstrate technical expertise in FD-SOI process technology and provide comprehensive support services.

  • Who is the buyer?

    The buyer is CEA/GRENOBLE.

  • When does this tender close?

    Submissions close on May 11, 2026.

  • What is the estimated value?

    The estimated value is 1 EUR.

Pour ses activités de recherche visant au développement des technologies FD-SOI 10 nm et au-delà, le CEA-LETI souhaite acquérir un équipement 300 mm pour du dépôt métallique par de PVD. L’équipement sera multi-chambres et devra inclure au moins 5 chambres de dépôt, une plateforme de transfert sous vide, une chambre d’oxydation dédiée, une chambre de pré-nettoyage et un module de dégazage. Le port de chargement devra permettre d’accueillir au moins 3 FOUPs Le marché envisagé comprend les options suivantes : - Option obligatoire : OPT1 : Extension de garantie 1 an supplémentaire (§11.1 du cahier des charges) - Options facultatives : OPT2 : Échangeurs de chaleur / Refroidisseurs (§3.2.6 du cahier des charges) OPT3 : Transformateur d'alimentation électrique (§4.1.4 du cahier des charges) OPT4 : Formation de maintenance de 1er niveau (§9 du cahier des charges) OPT5 : Formation de maintenance de niveau avancé (§9 du cahier des charges)

Buyer
CEA/GRENOBLE
Buyer ID: 775 685 019 00298·Syrga TURGANALIEVA
17 avenue des Martyrs, 38054, Grenoble
Body responsible for review procedures
GREFFE DU TRIBUNAL ADMINISTRATIF DE GRENOBLE
Buyer ID: 17800053
2 Place de Verdun, Boite Postale 1135, 38022, GRENOBLE CEDEX
Other organization
Publications Office of the European Union
Buyer ID: PUBL
2417, Luxembourg

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